Operating System Compatibility:Windows 10, Linux, macOS
Data Processing Speed:120 Mbps
Input/Output Channels:16 Input, 8 Output
Power Consumption:15W
Operating Temperature Range:-20°C to +70°C
Dimensions (WxDxH):100mm x 50mm x 25mm
Connector Type:RS-485, USB 3.0
Memory Capacity:512MB RAM, 4GB Flash
Engineered with cutting-edge technology, the RTP 3003/00 SER 3000 I/O module boasts a sleek, compact design optimized for both efficiency and durability in harsh industrial environments. This module is compatible with a wide range of operating systems, ensuring seamless integration into existing automation infrastructures.
Featuring a high-speed data processing capability of 120 Mbps, this I/O module ensures rapid and accurate data transmission, crucial for real-time control systems where every millisecond counts. With its robust input/output capacity of 16 input and 8 output channels, it caters to diverse control needs across various industries.
Equipped with advanced power management features, the module operates efficiently with a low power consumption of 15W, making it an environmentally conscious choice without compromising on performance. Its temperature range of -20°C to +70°C ensures reliable operation under extreme conditions, enhancing system uptime and reducing maintenance costs.
The module’s compatibility with RS-485 and USB 3.0 connectors allows for versatile connectivity options, facilitating easy setup and integration with a wide array of devices and systems. Additionally, the onboard memory capacity of 512MB RAM and 4GB Flash ensures ample storage for program execution and data logging, supporting extensive customization and operational flexibility.
Crafted from high-quality materials for enhanced durability and resistance to corrosion, the RTP 3003/00 SER 3000 I/O module is designed to withstand rigorous industrial usage, ensuring long-lasting performance and minimal downtime. Its compact size and modular design make it an ideal fit for space-constrained applications, enabling efficient installation and scalability in future upgrades.
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